Advanced Multicore Systems-On-Chip by Abderazek Ben Abdallah

Author:Abderazek Ben Abdallah
Language: eng
Format: epub
Publisher: Springer Singapore, Singapore

5.2.8 Conclusion

Future applications are getting more and more complex, demanding a good architecture to ensure a sufficient bandwidth for any transaction between memories and cores as well as communication between different cores on the same chip. 2D-NoC architecture is efficient for medium-scale multicore SoC systems. However, soon it will not be probably a good candidate for large-scale heterogeneous many-core systems consisting of more than a thousand cores.

With the emergence of 3D integration technologies, a new opportunity emerges for chip architects by porting the 2D-NoC to the third dimension. In 3D integration technologies, multiple layers of active devices are stacked above each other and vertically interconnected using through-silicon via (TSV). As compared to 2D-IC designs, 3D-ICs allow for performance enhancements even in the absence of scaling because of the reduced interconnect lengths. In addition, package density is increased, power consumption is reduced, and the system is more immune to noise.

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